PDF Determining the Bond Efficiency of industrial grinding circuits
product fineness to apply—the ball mill circuit P80 should be no less than approximately 70 µm (Bond, 1962). This Bond Efficiency determination should not be applied to circuits with a P80 finer than approximately 70 µm without making qualifications. 3. Calculate the circuit Wi Efficiency Ratio (equation 4): WiSTD Wi Efficiency Ratio ...